Focusing on the entire semiconductor and integrated circuit (IC) industry chain, SICE 2027 will bring together leading companies, innovative technologies, and industry solutions from around the world, serving as a professional international platform for product showcases, technology exchange, sourcing, and industrial collaboration.

The event will attract domestic and international buyers, technical decision-makers, R&D engineers, manufacturers, and industry professionals. Supported by well-organized exhibition zones and targeted buyer programs, visitors can efficiently connect with quality suppliers, explore the latest technologies and applications, compare solutions, and establish valuable business partnerships, supporting procurement, technology upgrades, and supply chain optimization.

I. Major Exhibits

•  IC Design / Chips and Applications: IC and related electronic product design, EDA, AI computing power chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products in the fields of the Internet of Things (IoT), AI, automotive electronics, smart cities, smart terminals, healthcare, etc.

•  IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging, and testing technologies and products, etc.

•  Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), fan-out wafer-level packaging, as well as related design, materials, testing, and equipment, etc.

•  Wafer Equipment / Packaging and Testing Equipment: Precision equipment and semiconductor packaging equipment required for wafer processing, semiconductor testing equipment, IC testing instruments, equipment for advanced packaging processes (such as SiP and 3D packaging), and power device equipment, etc.

•  Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, as well as upstream equipment and materials, etc.

•  Semiconductor Materials: Monocrystalline silicon, wafers and silicon-based materials, polishing pads, photomasks, sputtering targets, polishing slurries, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.

•  Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC components, robots, quartz components, filters, RF power supplies, ceramic components, ESC electrostatic chucks, pressure gauges, pumps, MFC flow controllers, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, cooling equipment, induction heaters, etc.

•  AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, etc.

Supporting Facilities and Services: Product support/cleanrooms, general business services/consulting, sales and services, standards, etc.

II. Exhibition Areas

•  IC Design / Chips and Applications Pavilion

•  C Manufacturing Pavilion

•  Wafer Equipment Pavilion

•  Packaging and Testing Equipment Pavilion

•  Core Components and Materials Pavilion

•  Compound Semiconductors and Power Devices Pavilion

•  AI Computing Power Pavilion

•  Supporting Facilities and Services Pavilion

•  Provincial and Municipal Pavilions & Regional Clusters Pavilion

Focusing on the latest breakthroughs in “high-end chips” and “domestic substitution,” the event strives to provide a cutting-edge platform for showcasing industry-leading technologies.

III. Target Audiences

It will attract professionals from around the world in semiconductors, IC, electronic power, electronics manufacturing, display manufacturing, as well as automotive, aerospace, healthcare, information and communications, and consumer electronics to participate in the exhibition. The event provides an efficient platform for participants to explore cutting-edge technologies, discuss collaborative strategies, jointly decode the new industrial ecosystem, and work together to build an open, collaborative, and resilient core future for the global semiconductor and IC industry.

IV. Booth Reservation

Your timely reservation will allow us to preassign exhibit space. Requests for exhibit space will be accepted on a “first come, first served” basis.

To reserve the booth of “SICE 2027” or learn more information, please contact:

Tel : (86-21) 5013-1760

E-mail: info@goldenexpo.com.cn